PRECISION CLEANING AND USES IN WET PROCESSES
For cleaning of semiconductor wafers, precision cleaning of printed circuit boards, DI water rinsing in wet processes, development, etching, stripping, slurry dispensing and film coating.
MEASURES AGAINST STATIC ELECTRICITY WITH DRY FOG HUMIDIFICATION
Overcoming problems such as electrostatic damage and dust adhesion that cannot be solved by static eliminators (ionizers) only. Reducing pick and place errors, lowering the failure rate and maintaining appropriate humidity in a cleanroom.
IMMERSION CLEANING OR LIQUID AGITATION IN AN ELECTROPLATING BATH
With their compact and lightweight design, ejector nozzles deliver excellent performance for agitation of plating solution, immersion cleaning of printed circuit boards, accelerated etching reaction on products submerged in an etchant, and agitation of a solution in a tank.
SLIT NOZZLES USED WITH LIQUID OR AIR
Slit nozzles produce a thin laminar flow of liquid or air of even thickness across the lateral direction, thus reducing chemical solution cost, DI water cost and air cost, and are suitable for smaller, more compact equipment.
BLOW-OFF, DRYING, AIR BLOW
Incorporating a noise suppressing design, TAIFUJet air nozzles boost and blow air with an even impact distribution, and are ideal for blowing off water remaining on PCB surfaces.Helps reduce air consumption
SLIT NOZZLES USED WITH AIR
Slit nozzles using air, also called air knives, blow air with an even distribution and are suitable for blowing off water remaining on the surfaces of PCBs or flat panels.